Product Center
Diversified product layout for AI, storage, general Purpose, etc.
CPU | Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors( Ice lake-SP), Intel® C621A Chipset |
TDP | 270W |
MEM | 16x DDR4 DIMM slots, Up to 4TB 3200/2933MHz ECC DDR4 RDIMM/LRDIMM |
GPU | Up to 4 FHFL(double-width), or 10 LP(single-width), or 10 FHLP(single- width) GPU |
Backplane | 12Gbps SAS/SATA、 U.3 Tri-mode(Optional)or Expander(Optional) |
Disk | 12/24 x 2.5/3.5”SAS/SATA3 ,or 6/12 x U.3(Optional) hot-swap drive bays Rear 2/4/6 x 2.5”SAS/SATA/U.3 hot-swap drive bays(Optional) |
RAID | SATA3 (6Gbps) ,Optional independent SAS RAID card with BBU |
NIC | Onboard 2 x 10 GbE (SFP+ X710-BM2) Onboard 1 x RJ45 IPMI |
I/O | USB 2.0、 USB 3.0、VGA、COM |
On-board Connect | 2 x M.2( 2280/110, PCI-E 2.0*2) from PCH 3 x Slim SAS 8i( PCI-E 4.0*8) from CPU 3 x SFF8643 ,2 x SATA 7 PIN from PCH |
PCI-E | Up to 4 x PCI-E 4.0*16(double-width ,switch 8 x PCI-E 4.0*8 single-width) +1 x PCI-E 4.0*8+ 2 x PCI-E 4.0*16 |
Power | CRPS 1200/1600/2000 W1+1 or 2+2 Redundant PSU |