Product Center
Diversified product layout for AI, storage, general Purpose, etc.
CPU |
Dual Socket P+ (LGA-4189) , 3rd Gen Intel® Xeon® Scalable processors ,Support CPU TDP 270W |
MEM |
16 DIMM slots,Up to 4TB 3DS ECC DDR4-3200MHz†RDIMM/LRDIMM |
Storage |
36 x 3.5“ hot-swap HDD( Front 24 、 Rear 12) +12*3.5 ” hot-wap HDD(Internal)+6 x 2.5 ” hot-swap HDD/Nvme SSD( Rear) +2 * M.2 |
PCI-E |
6 * PCI-E 4.0 x16 slots 5 * PCI-E 4.0 x8 slots |
I/O |
4 USB 3.0 2x VGA 1 xCOM |
NIC |
Onboard 2 x 10 GbE (SFP+) Onboard 1* RJ45 IPMI LAN port |
IPMI |
IPMI 2.0, KVM/media over LAN (Aspeed® AST2600 Control) |
Power |
1200W 1+1 Redundant Power Supplies |